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| FDLL3595 General Description: A General Purpose diode that couples high forward conductance fast switching speed and high blocking voltages in a glass leadless LL-34 Surface Mount package. Placement of the Expansion Gap has no relationship to the location of the Cathode Terminal which is indicated by the first color band. Cathode Band ORANGE YELLOW High Conductance, Low Leakage Diode Absolute Maximum Ratings* Sym Tstg TJ PD R OJA Wiv IO IF if iF(surge) Expansion Gap TA = 25OC unless otherwise noted Parameter Storage Temperature Operating Junction Temperature Total Power Dissipation at TA = 25OC Linear Derating Factor from TA = 25OC Thermal Resistance Junction-to-Ambient Working Inverse Voltage Average Rectified Current DC Forward Current (IF) Recurrent Peak Forward Current Peak Forward Surge Current (IFSM) Pulse Width = 1.0 second Pulse Width = 1.0 microsecond Value -65 to +200 -65 to +200 500 3.33 350 125 200 500 600 1.0 4.0 Units OC OC mW mW/OC OC/W V mA mA mA Amp Amp *These ratings are limiting values above which the serviceability of any semiconductor device may be impaired Electrical Characteristics SYM BV IR TA = 25OC unless otherwise noted CHARACTERISTICS Breakdown Voltage Reverse Leakage MIN 150 MAX UNITS V IR VR VR VR VR IF IF IF IF IF IF TEST CONDITIONS = 100 uA = 125 V = 30 V TA = 125OC = 125 V TA = 125OC = 180 V TA = 150OC = 1.0 mA = 5.0 mA = 10 mA = 50 mA = 100 mA = 200 mA 0.0 V, f = 1.0 MHz 1.0 300 500 3.0 520 600 650 750 790 0.83 680 750 800 880 920 1.00 8.0 3.0 nA nA nA uA mV mV mV mV mV V pF us VF Forward Voltage CT Capacitance TRR Reverse Recovery Time (c) 2000 Fairchild Semiconductor Corporation VR = IF = 10 mA VR = 3.5 V RL = 1.0 kOhms FDLL3595 - Rev. A THE PLACEMENT OF THE EXPANSION GAP HAS NO RELATIONSHIP TO THE LOCATION OF THE CATHODE TERMINAL OF THE DEVICE. THE EXPANSION GAP & CATHODE BAND CAN BE ON THE SAME TERMINAL OR AT OPPOSITE TERMINALS OF THE DIODE. TERMINALS: DUMET (ALLOY 47) 0.059 (1.499) 0.055 (1.397) EXPANSION GAP 0.138 (3.505) 0.130 (3.302) 0.104 (2.64) REFERENCE GLASS SLEEVE 0.020 (0.50) 0.014 (0.35) LL-34 JEDEC (AC VERSION) Fairchild Semiconductor's Criteria 5-MAR-98 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM BottomlessTM CoolFETTM CROSSVOLTTM DenseTrenchTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM DISCLAIMER FAST FASTrTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM ISOPLANARTM LittleFETTM MicroFETTM MICROWIRETM OPTOLOGICTM OPTOPLANARTM PACMANTM POPTM PowerTrench QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM SILENT SWITCHER SMART STARTTM StealthTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM UHCTM UltraFET VCXTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. H2 |
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